René Poelma
René Poelma
Department of Microelectronics, Delft University of Technology
Verified email at - Homepage
Cited by
Cited by
Tailoring the mechanical properties of high‐aspect‐ratio carbon nanotube arrays using amorphous silicon carbide coatings
RH Poelma, B Morana, S Vollebregt, E Schlangen, HW van Zeijl, X Fan, ...
Advanced Functional Materials 24 (36), 5737-5744, 2014
An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation
ECA Nyns, RH Poelma, L Volkers, JJ Plomp, CI Bart, AM Kip, ...
Science translational medicine 11 (481), eaau6447, 2019
Effects of single vacancy defect position on the stability of carbon nanotubes
RH Poelma, H Sadeghian, S Koh, GQ Zhang
Microelectronics Reliability 52 (7), 1279-1284, 2012
A numerical experimental approach for characterizing the elastic properties of thin films: application of nanocantilevers
RH Poelma, H Sadeghian, SPM Noijen, JJM Zaal, GQ Zhang
Journal of Micromechanics and Microengineering 21 (6), 065003, 2011
Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
C Silvestri, M Riccio, RH Poelma, B Morana, S Vollebregt, F Santagata, ...
Nanoscale 8 (15), 8266-8275, 2016
Effects of nanostructure and coating on the mechanics of carbon nanotube arrays
RH Poelma, X Fan, ZY Hu, G Van Tendeloo, HW van Zeijl, GQ Zhang
Advanced Functional Materials 26 (8), 1233-1242, 2016
High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout
B El Mansouri, LM Middelburg, RH Poelma, GQ Zhang, HW van Zeijl, ...
Microsystems & nanoengineering 5 (1), 1-14, 2019
Stretchable binary Fresnel lens for focus tuning
X Li, L Wei, RH Poelma, S Vollebregt, J Wei, HP Urbach, PM Sarro, ...
Scientific Reports 6 (1), 1-8, 2016
Effects of Conformal nanoscale coatings on thermal performance of vertically aligned carbon nanotubes
C Silvestri, M Riccio, RH Poelma, A Jovic, B Morana, S Vollebregt, A Irace, ...
Small 14 (20), 1800614, 2018
Tunable binary fresnel lens based on stretchable pdms/cnt composite
X Li, L Wei, S Vollebregt, R Poelma, Y Shen, J Wei, P Urbach, PM Sarro, ...
2015 Transducers-2015 18th International Conference on Solid-State Sensors …, 2015
Multi-LED package design, fabrication and thermal analysis
RH Poelma, S Tarashioon, HW van Zeijl, S Goldbach, JLJ Zijl, GQ Zhang
Journal of Semiconductors 34 (5), 054002, 2013
3D Interconnect technology based on low temperature copper nanoparticle sintering
B Zhang, YCP Carisey, A Damian, RH Poelma, GQ Zhang, HW van Zeijl
2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016
Metallic nanoparticle based interconnect for heterogeneous 3D integration
HW Van Zeijl, Y Carisey, A Damian, RH Poelma, A Zinn, CQ Zhang
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 217-224, 2016
Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects
A Khiat, RH Poelma, GQ Zhang, F Heuck, FD Tichelaar, M Sarno, ...
Microelectronic engineering 98, 317-320, 2012
Establishment of the coarse grained parameters for epoxy-copper interfacial separation
CKY Wong, SYY Leung, RH Poelma, KMB Jansen, CCA Yuan, ...
Journal of Applied Physics 111 (9), 094906, 2012
Through-polymer via (TPV) and method to manufacture such a via
RH Poelma, H Van Zeijl, G Zhang
WO 2014107108 (A1), 2014
Low temperature hybrid wafer bonding for 3D integration
AA Damian, RH Poelma, HW van Zeijl, GQ Zhang
2013 14th International Conference on Thermal, Mechanical and Multi-Physics …, 2013
Molecular dynamics study of the traction-displacement relations of epoxy-copper interfaces
CKY Wong, SYY Leung, RH Poelma, KMB Jansen, CCA Yuan, ...
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011
Through-polymer-via for 3D heterogeneous integration and packaging
J Hamelink, RH Poelma, M Kengen
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-7, 2015
Stiction-induced sealing of surface micromachined channels
B Morana, RH Poelma, G Fiorentino, J Wei, JF Creemer, PM Sarro
Journal of microelectromechanical systems 23 (2), 459-470, 2013
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