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Co-authors
- Siddharth RajanElectrical and Computer Engineering, Ohio State UniversityVerified email at ece.osu.edu
- Manik GoyalIntelVerified email at ucsb.edu
- Mohamed BoucheritX-Fab MEMS FoundryVerified email at xfab.com
- David Kealhoferpostdoc, ETH ZürichVerified email at ethz.ch
- Timo SchumannLumiphase AGVerified email at lumiphase.com
- Santosh RaghavanUCSBVerified email at mrl.ucsb.edu
- Jacob B KhurginJohns Hopkins UniversityVerified email at jhu.edu
- Sanyam BajajIntel CorporationVerified email at intel.com
- Sriram KrishnamoorthyUniversity of California, Santa BarbaraVerified email at ucsb.edu
- PIL SUNG PARKTechnology Development Center, Samsung ElectronicsVerified email at osu.edu
- Fatih AkyolYıldız Teknik ÜniversitesiVerified email at yildiz.edu.tr
- Luca GallettiSenior Researcher - Quantum, Microsoft Azure QuantumVerified email at microsoft.com
- Subramaniam ArulkumaranTemasek Laboratories@NTU, Nanyang Technological UniversityVerified email at ntu.edu.sg
- Sudhiranjan TripathyAgency for Science, Technology, and Research (A*STAR-IMRE, Singapore)Verified email at imre.a-star.edu.sg
- Geok Ing NgNanyang Technological UniversityVerified email at ntu.edu.sg
- Christopher R FreezeUniversity of California, Santa BarbaraVerified email at umail.ucsb.edu
- Ahmad ZubairSemiconductor Research Engineer, Technology Research, IntelVerified email at intel.com
- Quazi D. M. KhosruBangladesh University of Engineering and TechnologyVerified email at eee.buet.ac.bd
- Honggyu KimAssistant Professor, University of FloridaVerified email at ufl.edu
- Junao ChengThe Ohio State UniversityVerified email at osu.edu
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Omor Shoron
Software Reaserch Engineer (Compact Device Modeling), Intel Corporation
Verified email at intel.com - Homepage