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Alessandro Magnani
Alessandro Magnani
SemiZabala
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Year
Fast novel thermal analysis simulation tool for integrated circuits (FANTASTIC)
L Codecasa, V d'Alessandro, A Magnani, N Rinaldi, PJ Zampardi
20th International Workshop on Thermal Investigations of ICs and Systems, 1-6, 2014
952014
Circuit-based electrothermal simulation of power devices by an ultrafast nonlinear MOR approach
L Codecasa, V d’Alessandro, A Magnani, A Irace
IEEE Transactions on Power Electronics 31 (8), 5906-5916, 2015
742015
SPICE modeling and dynamic electrothermal simulation of SiC power MOSFETs
V d'Alessandro, A Magnani, M Riccio, G Breglio, A Irace, A Castellazzi
IEEE 26th International Symposium on Power Semiconductor Devices and ICs …, 2014
512014
Matrix reduction tool for creating boundary condition independent dynamic compact thermal models
L Codecasa, V d'Alessandro, A Magnani, N Rinaldi
2015 21st International Workshop on Thermal Investigations of ICs and …, 2015
462015
On-Line Junction Temperature Monitoring of Switching Devices with Dynamic Compact Thermal Models Extracted with Model Order Reduction
F Di Napoli, A Magnani, M Coppola, P Guerriero, V D’Alessandro, ...
Energies 10 (2), 189, 2017
412017
Delphi-like dynamical compact thermal models using model order reduction
B Rogié, L Codecasa, E Monier-Vinard, V Bissuel, N Laraqi, O Daniel, ...
2017 23rd International Workshop on Thermal Investigations of ICs and …, 2017
332017
Compact dynamic modeling for fast simulation of nonlinear heat conduction in ultra-thin chip stacking technology
L Codecasa, V d’Alessandro, A Magnani, N Rinaldi
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014
332014
Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations
V d’Alessandro, A Magnani, M Riccio, Y Iwahashi, G Breglio, N Rinaldi, ...
Microelectronics reliability 53 (9-11), 1713-1718, 2013
332013
Analysis of the Influence of Layout and Technology Parameters on the Thermal Impedance of GaAs HBT/BiFET Using a Highly-Efficient Tool
A Magnani, V d'Alessandro, L Codecasa, PJ Zampardi, B Moser, ...
Compound Semiconductor Integrated Circuit Symposium (CSICs), 2014 IEEE, 1-4, 2014
292014
Novel MOR approach for extracting dynamic compact thermal models with massive numbers of heat sources
L Codecasa, A Magnani, V d'Alessandro, N Rinaldi, AG Metzger, ...
2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2016
282016
Advanced thermal simulation of SiGe: C HBTs including back-end-of-line
V d'Alessandro, A Magnani, L Codecasa, N Rinaldi, K Aufinger
Microelectronics Reliability 67, 38-45, 2016
272016
Thermal feedback blocks for fast and reliable electrothermal circuit simulation of power circuits at module level
A Magnani, F Di Napoli, M Riccio, P Guerriero, V d'Alessandro, G Breglio, ...
2016 28th International Symposium on Power Semiconductor Devices and ICs …, 2016
272016
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies
V d'Alessandro, AP Catalano, A Magnani, L Codecasa, N Rinaldi, ...
Microelectronics Reliability 78, 233-242, 2017
252017
Parametric compact thermal models by moment matching for variable geometry
L Codecasa, V d'Alessandro, A Magnani, N Rinaldi
20th International Workshop on Thermal Investigations of ICs and Systems, 1-6, 2014
252014
Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction
L Codecasa, A Magnani, N Rinaldi
Microelectronics Journal 46 (12), 1129-1137, 2015
242015
Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction
L Codecasa, V d'Alessandro, A Magnani, N Rinaldi
2015 21st International Workshop on Thermal Investigations of ICs and …, 2015
232015
Integration of 650 V GaN Power ICs on 200 mm Engineered Substrates
X Li, K Geens, D Wellekens, M Zhao, A Magnani, N Amirifar, B Bakeroot, ...
IEEE Transactions on Semiconductor Manufacturing 33 (4), 534-538, 2020
222020
Dynamic electrothermal macromodeling: an application to signal integrity analysis in highly integrated electronic systems
V d'Alessandro, M de Magistris, A Magnani, N Rinaldi, S Russo
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (7 …, 2013
212013
Fast Nonlinear Dynamic Compact Thermal Modeling With Multiple Heat Sources in Ultra-Thin Chip Stacking Technology
L Codecasa, V d’Alessandro, A Magnani, N Rinaldi
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (1 …, 2017
192017
Calibration of detailed thermal models by parametric dynamic compact thermal models
L Codecasa, V d'Alessandro, A Magnani, N Rinaldi
2016 22nd International Workshop on Thermal Investigations of ICs and …, 2016
182016
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