| SOT-MRAM 300mm integration for low power and ultrafast embedded memories K Garello, F Yasin, S Couet, L Souriau, J Swerts, S Rao, S Van Beek, ... 2018 IEEE symposium on VLSI Circuits, 81-82, 2018 | 155 | 2018 |
| Persistent organic pollutants (POPs) in human milk: a biomonitoring study in rural areas of Flanders (Belgium) K Croes, A Colles, G Koppen, E Govarts, L Bruckers, E Van De Mieroop, ... Chemosphere 89 (8), 988-994, 2012 | 136 | 2012 |
| Atomic layer deposition of ruthenium with TiN interface for sub-10 nm advanced interconnects beyond copper LG Wen, P Roussel, OV Pedreira, B Briggs, B Groven, S Dutta, ... ACS applied materials & interfaces 8 (39), 26119-26125, 2016 | 105 | 2016 |
| Impact of Wire Geometry on Interconnect RC and Circuit Delay I Ciofi, A Contino, PJ Roussel, R Baert, VH Vega-Gonzalez, K Croes, ... IEEE Transactions on Electron Devices 63 (6), 2488-2496, 2016 | 101 | 2016 |
| Alternative metals for advanced interconnects C Adelmann, LG Wen, AP Peter, YK Siew, K Croes, J Swerts, M Popovici, ... IEEE International Interconnect Technology Conference, 173-176, 2014 | 86 | 2014 |
| Ruthenium metallization for advanced interconnects LG Wen, C Adelmann, OV Pedreira, S Dutta, M Popovici, B Briggs, ... 2016 ieee international interconnect technology conference/advanced …, 2016 | 74 | 2016 |
| Direct observation of the 1/E dependence of time dependent dielectric breakdown in the presence of copper L Zhao, Z Tőkei, K Croes, CJ Wilson, M Baklanov, GP Beyer, C Claeys Applied Physics Letters 98 (3), 2011 | 71 | 2011 |
| Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects I Panchenko, K Croes, I De Wolf, J De Messemaeker, E Beyne, KJ Wolter Microelectronic engineering 117, 26-34, 2014 | 69 | 2014 |
| Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects OV Pedreira, K Croes, A Leśniewska, C Wu, MH Van Der Veen, ... 2017 IEEE international reliability physics symposium (irps), 6B-2.1-6B-2.8, 2017 | 68 | 2017 |
| Interconnect metals beyond copper: Reliability challenges and opportunities K Croes, C Adelmann, CJ Wilson, H Zahedmanesh, OV Pedreira, C Wu, ... 2018 IEEE International Electron Devices Meeting (IEDM), 5.3. 1-5.3. 4, 2018 | 64 | 2018 |
| Impact of post-plating anneal and through-silicon via dimensions on Cu pumping J De Messemaeker, OV Pedreira, B Vandevelde, H Philipsen, I De Wolf, ... 2013 IEEE 63rd electronic components and technology conference, 586-591, 2013 | 63 | 2013 |
| Modeling of via resistance for advanced technology nodes I Ciofi, PJ Roussel, Y Saad, V Moroz, CY Hu, R Baert, K Croes, A Contino, ... IEEE transactions on Electron Devices 64 (5), 2306-2313, 2017 | 61 | 2017 |
| Electrical reliability challenges of advanced low-k dielectrics C Wu, Y Li, MR Baklanov, K Croes ECS Journal of Solid State Science and Technology 4 (1), N3065, 2014 | 61 | 2014 |
| Reliability of copper low-k interconnects Z Tőkei, K Croes, GP Beyer Microelectronic Engineering 87 (3), 348-354, 2010 | 60 | 2010 |
| Damascene benchmark of Ru, Co and Cu in scaled dimensions MH van der Veen, N Heyler, OV Pedreira, I Ciofi, S Decoster, ... 2018 IEEE International Interconnect Technology Conference (IITC), 172-174, 2018 | 55 | 2018 |
| Correlation between Cu microstructure and TSV Cu pumping J De Messemaeker, OV Pedreira, H Philipsen, E Beyne, I De Wolf, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 613-619, 2014 | 53 | 2014 |
| Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects P Absil, K Croes, A Lesniewska, P De Heyn, Y Ban, B Snyder, J De Coster, ... 2017 IEEE International Electron Devices Meeting (IEDM), 34.2. 1-34.2. 4, 2017 | 50 | 2017 |
| Endocrine actions of pesticides measured in the Flemish environment and health studies (FLEHS I and II) K Croes, E Den Hond, L Bruckers, E Govarts, G Schoeters, A Covaci, ... Environmental Science and Pollution Research 22, 14589-14599, 2015 | 48 | 2015 |
| Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies MH Van der Veen, K Vandersmissen, D Dictus, S Demuynck, R Liu, X Bin, ... 2015 IEEE International Interconnect Technology Conference and 2015 IEEE …, 2015 | 45 | 2015 |
| Low field TDDB of BEOL interconnects using> 40 months of data K Croes, P Roussel, Y Barbarin, C Wu, Y Li, J Bömmels, Z Tőkei 2013 IEEE International Reliability Physics Symposium (IRPS), 2F. 4.1-2F. 4.8, 2013 | 44 | 2013 |
