Shuai Jin
Title
Cited by
Cited by
Year
Analytical and numerical sensitivity analyses of fixtures de-embedding
B Chen, M Tsiklauri, C Wu, S Jin, J Fan, X Ye, B Samaras
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
312016
Validating the transmission-line based material property extraction procedure including surface roughness for multilayer PCBs using simulations
S Jin, X Fang, B Chen, H Gao, X Ye, J Fan
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
282016
Improved “Root-Omega” method for transmission-line-based material property extraction for multilayer PCBs
S Jin, B Chen, X Fang, H Gao, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 59 (4), 1356-1367, 2017
272017
Characterization of PCB dielectric properties using two striplines on the same board
L Hua, B Chen, S Jin, M Koledintseva, J Lim, K Qiu, R Brooks, J Zhang, ...
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014
272014
Thru-reflect-line calibration technique: Error analysis for characteristic impedance variations in the line standards
L Ye, C Li, X Sun, S Jin, B Chen, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 59 (3), 779-788, 2016
242016
Optimization of the transition from connector to PCB board
S Jin, J Zhang, J Fan
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on …, 2013
232013
Conducted-emission modeling for a switched-mode power supply (SMPS)
Y Wang, S Bai, X Guo, S Jin, Y Zhang, J Eriksson, L Qu, J Huang, J Fan
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity …, 2015
212015
Variability analysis of crosstalk among differential vias using polynomial-chaos and response surface methods
Y Wang, S Jin, S Penugonda, J Chen, J Fan
IEEE Transactions on Electromagnetic Compatibility 59 (4), 1368-1378, 2017
182017
Analytical equivalent circuit modeling for BGA in high-speed package
S Jin, D Liu, B Chen, R Brooks, K Qiu, J Lim, J Fan
IEEE Transactions on Electromagnetic Compatibility 60 (1), 68-76, 2017
172017
Analytical equivalent circuit modeling for multiple core vias in a high-speed package
S Jin, J Zhang, J Lim, K Qiu, R Brooks, J Fan
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
142016
Differential S-parameter de-embedding for 8-port network
B Chen, J He, X Sun, Y Guo, S Jin, X Ye, J Fan
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018
132018
A survey on modeling strategies for high-speed differential Via between two parallel plates
J Xu, Y Wang, Y Zhang, C Sui, B Sen, S Jin, J Fan
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017
132017
Estimating the via-plane capacitance for differential vias with shared-antipad based on analytical equations
Y Zhang, Y Wang, J Xu, C Sui, B Sen, S Jin, J Fan
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017
122017
Conducted-emission modeling for a high-speed ECL clock buffer
S Jin, Y Zhang, Y Zhou, Y Bai, X Yu, J Fan
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014
122014
Variability analysis of crosstalk among pairs of differential vias using polynomial-chaos and design of experiments methods
Y Wang, S Penugonda, S Jin, J Chen, J Fan
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
112016
Differential integrated crosstalk noise (ICN) mitigation in the pin field area of SerDes channel
B Chen, J Wang, YS Cao, M Ouyang, Y Wang, S Jin, G Shen, X Liu, ...
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018
102018
Differential integrated crosstalk noise (ICN) reduction among multiple differential BGA and via pairs by using design of experiments (DoE) method
B Chen, M Ouyang, S Yong, Y Wang, J Wang, S Jin, Y Bai, Y Zhou, J Fan
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017
102017
Parallel plate impedance and equivalent inductance extraction considering proximity effect by a modal approach
S Jin, D Liu, Y Wang, B Chen, J Fan
IEEE Transactions on Electromagnetic Compatibility 60 (5), 1481-1490, 2018
82018
Analyzing multiple vias in a parallel-plate pair based on a nonorthogonal PEEC method
X Sun, T Huang, L Ye, Y Sun, S Jin, J Fan
IEEE Transactions on Electromagnetic Compatibility 61 (5), 1602-1611, 2018
72018
Thru-Line De-embedding (TLD) an Accurate and Simplified Fixture Removal Method with Self-validating Line Standard
B Chen, X Ye, Q Huang, S Jin, J Fan
DesignCon, 2017
72017
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Articles 1–20