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Nauman Khan
Nauman Khan
Geverifieerd e-mailadres voor cs.tufts.edu
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Power delivery design for 3-D ICs using different through-silicon via (TSV) technologies
NH Khan, SM Alam, S Hassoun
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 19 (4), 647-658, 2010
1562010
System-level comparison of power delivery design for 2D and 3D ICs
NH Khan, SM Alam, S Hassoun
2009 IEEE International Conference on 3D System Integration, 1-7, 2009
642009
Through-silicon via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs
NH Khan, SM Alam, S Hassoun
2009 IEEE International Conference on 3D System Integration, 1-7, 2009
492009
Mitigating TSV-induced substrate noise in 3-D ICs using GND plugs
NH Khan, SM Alam, S Hassoun
2011 12th International Symposium on Quality Electronic Design, 1-6, 2011
242011
Designing TSVs for 3D integrated circuits
N Khan, S Hassoun
Springer Science & Business Media, 2012
152012
GND plugs: A superior technology to mitigate TSV-induced substrate noise
NH Khan, SM Alam, S Hassoun
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 2013
132013
Non-wood forest products of Bangladesh: an overview
SA Khan, NA Khan
Bangladesh J For Sci 23 (1), 45-50, 1994
131994
Effects of soil application of certain fungal and bacterial bioagents against Meloidogyne incognita infecting chick pea
MR Khan, SM Khan, N Khan
Proceedings of National congress on Centenary of Nematology in India …, 2001
112001
Virtual worlds for young people in a program context: Lessons from four case studies
MU Bers, L Beals, C Chau, K Satoh, N Khan
New science of learning: Cognition, computers and collaboration in education …, 2010
102010
Early estimation of TSV area for power delivery in 3-D integrated circuits
NH Khan, S Reda, S Hassoun
2010 IEEE International 3D Systems Integration Conference (3DIC), 1-6, 2010
92010
The feasibility of Carbon Nanotubes for power delivery in 3-D Integrated Circuits
NH Khan, S Hassoun
17th Asia and South Pacific Design Automation Conference, 53-58, 2012
62012
Fatal sepsis due to Pseudomonas cepacia.
SK Saha, M Hanif, WA Khan, D Rahaman, N Khan, MS Hoq, G Sarwardi
Singapore medical journal 35 (5), 475-476, 1994
41994
Effect of various NPK levels on green fodder yield of berseem
S Khan, N Khan
Sarhad Journal of Agriculture (Pakistan) 2 (4), 1986
31986
Method to mitigate through-silicon via-induced substrate noise
NH Kahn, S Hassoun, SM Alam
US Patent App. 14/004,472, 2014
22014
Through-silicon via analysis for the design of 3-D integrated circuits
NH Khan
Tufts University, 2011
22011
A distributed application model for mobile networks
NH Khan, S Khan, MO Cheema, MN Ayyaz
7th International Multi Topic Conference, 2003. INMIC 2003., 157-163, 2003
22003
104P Pathologic tumor response & long term outcome with neoadjuvant trastuzumab in Her-2 positive breast cancer
S Zeeshan, SM Khan, N Khan
Annals of Oncology 27, ix31, 2016
12016
Chemosterilization of Dacus cucurbitae Coq.
S Khan, NH Khan
11976
Bio-efficacy of herbicides against different weed flora of wheat in central plain zone of Uttar Pradesh
MZ Siddiqui, RA Yadav, N Khan, GS Parihar, A Kumar
Annals of Agricultural Research 37 (2), 2016
2016
Early Estimation of TSV Area for Power Delivery in 3-D ICs
N Khan, S Hassoun, N Khan, S Hassoun
Designing TSVs for 3D Integrated Circuits, 43-51, 2013
2013
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Artikelen 1–20