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Co-authors
- Hema C. P. MovvaIntel CorporationVerified email at intel.com
- Sushant SondeUT Austin, CNR-IMM, IMECVerified email at austin.utexas.edu
- rahul ramaswamyUniversity at Buffalo, State univeristy of New YorkVerified email at buffalo.edu
- Babak FallahazadIntel CorporationVerified email at intel.com
- Anupam RoyThe University of Texas at AustinVerified email at austin.utexas.edu
- Seth R. BankUniversity of Texas at AustinVerified email at ece.utexas.edu
- Emily S Kabir (Walker)Intel LTD | Intel Components Research | University of Texas at AustinVerified email at utexas.edu
- Praveen PasupathyThe University of Texas at AustinVerified email at utexas.edu
- Amritesh RaiFront End Process Integration Engineer @ Intel ▪️ UT Austin ▪️ Ohio StateVerified email at utexas.edu
- Emanuel TutucProfessor, The University of Texas at AustinVerified email at mer.utexas.edu
- Sangwoo KangIntel CorporationVerified email at intel.com
- Stefano LarentisFA Engineer @ NXP SemiconductorsVerified email at utexas.edu
- Amithraj ValsarajCore Compact Modeling, Intel CorporationVerified email at utexas.edu
- Leonard F. RegisterProfessor of Electrical and Computer EngineeringVerified email at austin.utexas.edu
- Sheng ZhangThe University of Texas at AustinVerified email at mail.utexas.edu
- Sarah MuschinskePhD student in EECS, MITVerified email at mit.edu
- Christopher J. BrennanUniversity of Texas at AustinVerified email at utexas.edu
- Ian WilliamsonGoogle XVerified email at ianwilliamson.me