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Yuan-Chun Luo
Yuan-Chun Luo
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Year
Monolithic 3D integration of high endurance multi-bit ferroelectric FET for accelerating compute-in-memory
S Dutta, H Ye, W Chakraborty, YC Luo, M San Jose, B Grisafe, A Khanna, ...
2020 IEEE International Electron Devices Meeting (IEDM), 36.4. 1-36.4. 4, 2020
902020
A novel scalable energy-efficient synaptic device: Crossbar ferroelectric semiconductor junction
M Si, Y Luo, W Chung, H Bae, D Zheng, J Li, J Qin, G Qiu, S Yu, PD Ye
2019 IEEE International Electron Devices Meeting (IEDM), 6.6. 1-6.6. 4, 2019
292019
Ferroelectric HfO2-based synaptic devices: recent trends and prospects
S Yu, J Hur, YC Luo, W Shim, G Choe, P Wang
Semiconductor Science and Technology 36 (10), 104001, 2021
272021
Ferroelectric hafnium zirconium oxide compatible with back-end-of-line process
J Hur, YC Luo, N Tasneem, AI Khan, S Yu
IEEE Transactions on Electron Devices 68 (7), 3176-3180, 2021
262021
Design of non-volatile capacitive crossbar array for in-memory computing
YC Luo, A Lu, J Hur, S Li, S Yu
2021 IEEE International Memory Workshop (IMW), 1-4, 2021
252021
Nonvolatile Capacitive Crossbar Array for In‐Memory Computing
J Hur, YC Luo, A Lu, TH Wang, S Li, AI Khan, S Yu
Advanced Intelligent Systems 4 (8), 2100258, 2022
212022
Ferroelectric tunnel junction based crossbar array design for neuro-inspired computing
YC Luo, J Hur, S Yu
IEEE Transactions on Nanotechnology 20, 243-247, 2021
202021
High-Peformance BEOL-Compatible Atomic-Layer-Deposited In2O3 Fe-FETs Enabled by Channel Length Scaling down to 7 nm: Achieving Performance Enhancement with …
Z Lin, M Si, YC Luo, X Lyu, A Charnas, Z Chen, Z Yu, W Tsai, PC McIntyre, ...
2021 IEEE International Electron Devices Meeting (IEDM), 17.4. 1-17.4. 4, 2021
172021
Non-volatile, small-signal capacitance in ferroelectric capacitors
YC Luo, J Hur, P Wang, AI Khan, S Yu
Applied Physics Letters 117 (7), 2020
172020
Characterizing Ferroelectric Properties of Hf0.5Zr0.5O2 From Deep-Cryogenic Temperature (4 K) to 400 K
J Hur, YC Luo, Z Wang, S Lombardo, AI Khan, S Yu
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits 7 …, 2021
132021
Compute-in-memory: From device innovation to 3D system integration
S Yu, W Shim, J Hur, Y Luo, G Choe, W Li, A Lu, X Peng
ESSDERC 2021-IEEE 51st European Solid-State Device Research Conference …, 2021
102021
2021 IEEE Int. Electron Devices Meeting (IEDM)
KA Aabrar, J Gomez, SG Kirtania, MS Jose, Y Luo, PG Ravikumar, ...
IEEE, 2021
102021
Ferroelectric tunnel junction optimization by plasma-enhanced atomic layer deposition
J Hur, YC Luo, P Wang, N Tasneem, AI Khan, S Yu
2020 IEEE Silicon Nanoelectronics Workshop (SNW), 11-12, 2020
92020
Tunable non-volatile gate-to-source/drain capacitance of FeFET for capacitive synapse
TH Kim, O Phadke, YC Luo, H Mulaosmanovic, J Mueller, S Duenkel, ...
IEEE Electron Device Letters, 2023
82023
A technology path for scaling embedded FeRAM to 28 nm and beyond with 2T1C structure
YC Luo, J Hur, Z Wang, W Shim, AI Khan, S Yu
IEEE Transactions on Electron Devices 69 (1), 109-114, 2021
72021
3-d heterogeneous integration of rram-based compute-in-memory: Impact of integration parameters on inference accuracy
A Kaul, Y Luo, X Peng, M Manley, YC Luo, S Yu, MS Bakir
IEEE Transactions on Electron Devices 70 (2), 485-492, 2022
52022
A ferroelectric-based volatile/non-volatile dual-mode buffer memory for deep neural network accelerators
Y Luo, YC Luo, S Yu
IEEE Transactions on Computers 71 (9), 2088-2101, 2021
52021
Design and optimization of non-volatile capacitive crossbar array for in-memory computing
YC Luo, A Lu, J Hur, S Li, S Yu
IEEE Transactions on Circuits and Systems II: Express Briefs 69 (3), 784-788, 2021
52021
Nonvolatile Capacitive Synapse: Device Candidates for Charge Domain Compute-In-Memory
S Yu, YC Luo, TH Kim, O Phadke
IEEE Electron Devices Magazine 1 (2), 23-32, 2023
42023
Scalable in-memory clustered annealer with temporal noise of FinFET for the travelling salesman problem
A Lu, J Hur, YC Luo, H Li, DE Nikonov, I Young, YK Choi, S Yu
2022 International Electron Devices Meeting (IEDM), 22.5. 1-22.5. 4, 2022
42022
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