| Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same ES Lee, B Koh, C Moon, K Chun US Patent 6,884,650, 2005 | 57 | 2005 |
| Wafer level package using polymer bonding of thick SU-8 photoresist K Na, E Lee, HC Kim, YH Lee, K Chun 2006 International Conference on MEMS, NANO, and Smart Systems, 31-34, 2006 | 9 | 2006 |
| MEMS device and fabrication method thereof E Lee, C Kim, IS Song, J Kim, M Lee US Patent 6,720,201, 2004 | 9 | 2004 |
| Wafer level lateral bonding scheme with LEGO-like structure E Lee, W Kim, I Song, C Moon, HC Kim, MK Kang, SD Choi, K Chun Sensors and Materials 17 (5), 227-236, 2005 | 8 | 2005 |
| MEMS device and fabrication method thereof E Lee, C Kim, IS Song, J Kim, M Lee US Patent 7,411,261, 2008 | 6 | 2008 |
| Si via interconnection technique for 3D MEMS package J Jeong, HC Kim, K Chun, E Lee, C Moon SENSORS, 2006 IEEE, 1187-1190, 2006 | 3 | 2006 |
| Fabrication of flat RF MEMS switch membrane by minimizing of stress gradients in the Au membrane structure JS Kim, H Song, JW Cho, ES Lee, SH Park, MC Lee, DH Shim, IS Song, ... MRS Online Proceedings Library (OPL) 741, J5. 2, 2002 | 3 | 2002 |
| Adhesive bonding using thick polymer film of SU-8 photoresist for wafer level package KH Na, IH Kim, ES Lee, HC Kim, KJ Chun Journal of Sensor Science and Technology 16 (5), 325-330, 2007 | 2 | 2007 |
| A morphology-independent wafer level rivet packaging with Lego-like assembly E Lee, W Kim, I Song, C Moon, MK Kang, HC Kim, K Chun The 13th International Conference on Solid-State Sensors, Actuators and …, 2005 | 1 | 2005 |
| Anti-stiction method and apparatus for drying wafer using centrifugal force J Cho, M Lee, E Lee US Patent App. 10/173,315, 2003 | 1 | 2003 |
| Interconnection Characteristics of Rivet Packaging for Radio Frequency Microelectromechanical Systems Applications S Kang, E Lee, HC Kim, B Lee, K Chun Sensors and Materials 23 (2), 101-110, 2011 | | 2011 |
| MEMS structure and method of fabricating the same YT Hong, J Kim, IS Song, S Kwon, SJ Oh, E Lee, S Choi US Patent 7,649,672, 2010 | | 2010 |
| Wafer Level Package of Optical devices Using Polymer Bonding K Na, E Lee, HC Kim, K Chun ITC-CSCC: International Technical Conference on Circuits Systems, Computers …, 2007 | | 2007 |
| Stacked packaging using vertical interconnection based on Si-through via JW Jeong, ES Lee, HC Kim, CY Moon, KJ Chun Proceedings of the IEEK Conference, 595-596, 2006 | | 2006 |
| Wafer Level Packaged MEMS Double Pole Double Throw Switch for Wireless Application S Moon, J Lee, E Lee, J Kim, HC Kim, K Chun ITC-CSCC: International Technical Conference on Circuits Systems, Computers …, 2005 | | 2005 |
| Low Pull-in Voltage MEMS Switches for Wireless Applications DH Shim, MC Lee, ES Lee, SH Park, YI Kim, IS Song Proceedings of the KIEE Conference, 1969-1971, 2002 | | 2002 |
| Si Via Interconnection Technique with Thermal Budget Design J Jeong, E Lee, HC Kim, C Moon, K Chun 2007 International Conference on Thermal Issues in Emerging Technologies …, 0 | | |
| Adhesive bonding using thick polymer film of SU-8 photoresist for wafer level package K Na, E Lee, HC Kim, K Chun | | |
