Xiang Fang
Xiang Fang
Unknown affiliation
Verified email at mst.edu
Title
Cited by
Cited by
Year
Validating the transmission-line based material property extraction procedure including surface roughness for multilayer PCBs using simulations
S Jin, X Fang, B Chen, H Gao, X Ye, J Fan
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
282016
Improved “Root-Omega” method for transmission-line-based material property extraction for multilayer PCBs
S Jin, B Chen, X Fang, H Gao, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 59 (4), 1356-1367, 2017
272017
Power integrity with voltage ripple spectrum decomposition for physics-based design
C Huang, B Zhao, K Shringarpure, S Bai, X Fang, T Makharashvili, H Ye, ...
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
82016
PEEC macromodels for above plane decoupling capacitors
X Fang, T Makharashvili, AE Ruehli, J Fan, J Drewniak, B Archambeault, ...
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems …, 2015
82015
Material properties characterization for multilayer PCB and PEEC macromodels for above plane decoupling capacitors
X Fang
Missouri University of Science and Technology, 2016
2016
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Articles 1–5