| Metal-organic framework ZIF-8 films as low-κ dielectrics in microelectronics S Eslava, L Zhang, S Esconjauregui, J Yang, K Vanstreels, MR Baklanov, ... Chemistry of Materials 25 (1), 27-33, 2013 | 269 | 2013 |
| Method and apparatus for microwave treatment of dielectric films I Ahmad, M Baklanov, L Zhang US Patent 9,414,445, 2016 | 48 | 2016 |
| Low damage cryogenic etching of porous organosilicate low-k materials using SF6/O2/SiF4 L Zhang, R Ljazouli, P Lefaucheux, T Tillocher, R Dussart, ... ECS Journal of Solid State Science and Technology 2 (6), N131, 2013 | 40 | 2013 |
| Damage free cryogenic etching of a porous organosilica ultralow-k film L Zhang, R Ljazouli, P Lefaucheux, T Tillocher, R Dussart, ... ECS Solid State Letters 2 (2), N5, 2012 | 39 | 2012 |
| Damage free integration of ultralow-k dielectrics by template replacement approach L Zhang, JF de Marneffe, N Heylen, G Murdoch, Z Tokei, J Boemmels, ... Applied Physics Letters 107 (9), 092901, 2015 | 35 | 2015 |
| Improved plasma resistance for porous low-k dielectrics by pore stuffing approach L Zhang, JF de Marneffe, MH Heyne, S Naumov, Y Sun, A Zotovich, ... ECS Journal of Solid State Science and Technology 4 (1), N3098, 2014 | 32 | 2014 |
| Vacuum ultra-violet damage and damage mitigation for plasma processing of highly porous organosilicate glass dielectrics JF de Marneffe, L Zhang, M Heyne, M Lukaszewicz, SB Porter, F Vajda, ... Journal of Applied Physics 118 (13), 133302, 2015 | 23 | 2015 |
| Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensation Z Liping, JF de Marneffe, F Leroy, P Lefaucheux, T Tillocher, R Dussart, ... | 21* | 2016 |
| Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensation L Zhang, JF de Marneffe, F Leroy, P Lefaucheux, T Tillocher, R Dussart, ... Journal of Physics D: Applied Physics 49 (17), 175203, 2016 | 21 | 2016 |
| Quantitative characterization of pore stuffing and unstuffing for postporosity plasma protection of low-k materials MH Heyne, L Zhang, J Liu, I Ahmad, D Toma, JF de Marneffe, S De Gendt, ... Journal of Vacuum Science & Technology B, Nanotechnology and …, 2014 | 21 | 2014 |
| Cryogenic etching processes applied to porous low-k materials using SF6/C4F8 plasmas F Leroy, L Zhang, T Tillocher, K Yatsuda, K Maekawa, E Nishimura, ... Journal of Physics D: Applied Physics 48 (43), 435202, 2015 | 19 | 2015 |
| Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above− 50° C R Chanson, L Zhang, S Naumov, YA Mankelevich, T Tillocher, ... Scientific reports 8 (1), 1-12, 2018 | 17 | 2018 |
| Surface-confined activation of ultra low-k dielectrics in CO2 plasma Y Sun, M Krishtab, Y Mankelevich, L Zhang, S De Feyter, M Baklanov, ... Applied Physics Letters 108 (26), 262902, 2016 | 11 | 2016 |
| Integration of porous low-k dielectrics using post porosity pore protection L Zhang, JF de Marneffe, P Verdonck, N Heylen, LG Wen, C Wilson, ... Journal of Physics D: Applied Physics 49 (50), 505105, 2016 | 10 | 2016 |
| Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films Y Sun, E Levrau, L Zhang, J Geypen, J Meersschaut, A Franquet, QT Le, ... Microelectronic Engineering 137, 70-74, 2015 | 10 | 2015 |
| Stuffing-enabled surface confinement of silanes used as sealing agents on CF 4 plasma-exposed 2.0 p-OSG films Y Sun, E Levrau, L Zhang, J Geypen, J Meersschaut, A Franquet, QT Le, ... Microelectronic Engineering 137, 70-74, 2015 | 10 | 2015 |
| Low-k protection from F radicals and VUV photons using a multilayer pore grafting approach A Zotovich, A Rezvanov, R Chanson, L Zhang, N Hacker, K Kurchikov, ... Journal of Physics D: Applied Physics 51 (32), 325202, 2018 | 9 | 2018 |
| Pore surface grafting of porous low-k dielectrics by selective polymers A Rezvanov, L Zhang, M Watanabe, MB Krishtab, L Zhang, N Hacker, ... Journal of Vacuum Science & Technology B, Nanotechnology and …, 2017 | 9 | 2017 |
| Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics M Baklanov, JF de Marneffe, L Zhang, I Ciofi, Z Tokei Solid State Technology 57 (5), 2014 | 7 | 2014 |
| Method of etching porous film S Tahara, E Nishimura, M Baklanov, L Zhang, J De Marneffe US Patent 9,859,102, 2018 | 5 | 2018 |
Mikhail BaklanovVerified email at ncut.edu.cn
