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Co-authors
- Deji AkinwandeThe University of Texas at Austin, IEEE, MRS, APS, AAS FellowVerified email at ece.utexas.edu
- Maruthi YogeeshDesign Engineer @ Intel, Researcher @ UCBerkeley;Verified email at berkeley.edu
- Nasibeh RahimiIntelVerified email at intel.com
- Hsiao-Yu ChangVerified email at utexas.edu
- Rudresh (Rudy) GhoshUniversity of Texas at AustinVerified email at rudyghosh.com
- Atresh SanneIntel, University of Texas at AustinVerified email at utexas.edu
- Li ShiUniversity of Texas at AustinVerified email at mail.utexas.edu
- Sk Fahad ChowdhuryMicroelectronics Research Center, UT AustinVerified email at utexas.edu
- Greg MordiThe University of Texas at DallasVerified email at utdallas.edu
- Jiyoung KimProfessor of Materials Science and Engineering, University of Texas at DallasVerified email at utdallas.edu
- Robert M. WallaceUniversity of Texas at DallasVerified email at utdallas.edu
- Srikar JandhyalaEngineering Manager, Intel CorporationVerified email at intel.com
- Sangchul LeePostdoctoral research associate at Stevens Insitute of TechnologyVerified email at stevens.edu
- Seung Heon ShinKorea PolytechnicsVerified email at kopo.ac.kr
- Dodabalapur, AnanthThe University of Texas at Austin OR Bell LaboratoriesVerified email at engr.utexas.edu
- SEOHEE KIMThe University of Texas at AustinVerified email at utexas.edu
- Young Gon LeeSK hynixVerified email at sk.com
- Mir Mohammad SadeghiUniversity of Texas at AustinVerified email at utexas.edu
- Jang-Sik LeeProfessor of Materials Science and Engineering, Pohang University of Science and Technology (POSTECHVerified email at postech.ac.kr
- Luigi ColomboUniversity of Texas at DallasVerified email at utdallas.edu